Rumor: Especificaciones de la nueva Nintendo 3DS

La noticia del día sin duda, los chicos de eurogamer han tenido acceso a la placa de desarrollo de la nueva Nintendo 3DS que era enviada para que la FCC validara el chip wi-fi. Según la misma (que ojo es de desarrollo y no será así la consola ni mucho menos) Nintendo 3DS tendrá una pantalla panorámica y otra inferior del tamaño de la DSi.

Actualización. Confirmadas estas especificaciones definitivas para Nintendo 3DS 

Size (when closed): Approximately 5.3 inches wide, 2.9 inches long, 0.8 inches tall.

Weight: Approximately 8 ounces.

Look: Final design is TBA.

Top Screen: 3.53-inch widescreen LCD display, enabling 3D view without the need for special
glasses; with 800x240 pixel resolution (400 pixels are allocated for each eye to
enable 3D viewing).

Touch Screen: 3.02-inch LCD with 320x240 pixel resolution with a touch screen.
Cameras: One inner camera and two outer cameras with 640x480 (0.3 Mega) pixel resolution.
Pre-Installed Software: TBA

Nintendo 3DS Game Card: 2 GB Max. at launch.

Wireless Communication: Can communicate in the 2.4 GHz band. Multiple Nintendo 3DS systems can connect
via a local wireless connection to let users communicate or enjoy competitive game play. Systems also can connect to LAN access points to access the Internet and allow people to enjoy games with others. Will support IEEE 802.11 with enhanced security (WPA/WPA2). Nintendo 3DS hardware is designed so that even when not in use, it can automatically exchange data with other Nintendo 3DS systems or receive
data via the Internet while in sleep mode.

Game Controls: Touch screen, embedded microphone, A/B/X/Y face buttons, + Control Pad, L/R
buttons, Start and Select buttons, “Slide Pad” that allows 360-degree analog input,
one inner camera, two outer cameras, motion sensor and a gyro sensor.

Other Input Controls: 3D Depth Slider to adjust level of 3D effect (can be scaled back or turned off
completely depending on the preference of the user), Home button to call system function, Wireless switch to turn off wireless communications (even during game play), Power button. The telescoping stylus is approximately 4 inches when fully
extended.

Input/Output: A port that accepts both Nintendo 3DS game cards and game cards for the Nintendo
DS™ family of systems, an SD memory card slot, an AC adapter connector, a charging cradle terminal and a stereo headphone output jack.

Sound: Stereo speakers positioned to the left and right of the top screen.
Battery: Lithium ion battery details TBA.

Languages: TBA

Parental Controls: Parental controls similar to the Nintendo DSi system will be included.

Además se especula que sólo la superior tendra funciones 3D. Tambien con el diseño de la placa se han podido averiguar algunas de las posibles especificaciones y caracteristicas de Nintendo 3DS:

• Capacidades wi-fi y bateria mejoradas enormemente con respecto a anteriores DS
• SoC Fabricado por NEC, versión a medida del Emma Mobile EV/2
• CPU Cortex A9 a 533Mhz, 256K cache L2, un solo núcleo.
• Controlador de memoria LP-DDR2 a 266Mhz.
• GPU PowerVR SGX 535 funcionando a 266Mhz (doble de veloz que el iPhone 3GS)
• 256MB LP-DDR2 como RAM principal (externa respecto al SoC)
• Se añade el chipset de DSi para compatibilidad con Nintendo DS

Veremos a ver si se confirman estas especificaciones aún así prometen y mucho.